A Breakthrough in Dispensing & Potting for Small and Micro Electronic Components! Intelligent Dispensing Line Enables Precise Volume Control & Unmanned Operation

In the production and manufacturing of small and micro electronic components such as sensors, relays, tire pressure monitoring modules, vehicle-mounted cameras and parking radars, the dispensing and potting process has long been a core pain point restricting production efficiency and product quality. These products have highly specific potting requirements, with the adhesive demand per unit mostly ranging from 1 to 5 grams. The precise control of trace adhesive volume has become a universally recognized industry challenge, coupled with the need to solve problems such as easy adhesive leakage and uneven volume during potting.

Under the traditional manual potting mode, it usually takes 2 to 3 repeated sealing operations to complete the process, which is also plagued by uncontrollable and low-precision adhesive volume. The randomness of manual operation easily leads to inconsistent potting quality of products, which not only drives up labor costs, but also fails to meet the demands of large-scale and standardized production, becoming an obstacle for many electronic component manufacturers to improve quality and efficiency.

Addressing this core industry pain point, a tailor-made intelligent dispensing and potting equipment for small and micro electronic components has emerged. Relying on its innovative three-stage operation design and real-time dynamic regulation technology, it completely solves the industry dilemma of trace dispensing and potting, bringing a brand-new solution for the production of electronic components! Breaking the traditional single-station operation mode, the equipment creates an integrated operation process of precision dispensing - vacuum defoaming - intelligent refilling, solving the problems of volume control and quality from the source.

The initial dispensing stage achieves micron-level precise adhesive output, strictly matching the trace volume demand of 1 to 5 grams and fundamentally avoiding volume deviation caused by manual operation. The secondary vacuum defoaming process effectively removes air bubbles generated during potting, prevents component performance failures due to bubbles, and greatly improves the sealing and stability of potting. The core third intelligent refilling station is equipped with a high-precision real-time monitoring system, which can accurately capture the volume data of the previous dispensing process and dynamically adjust the refilling volume according to the actual missing amount, realizing "refilling exactly what is needed". This completely eliminates the problems of excessive or insufficient adhesive volume, achieving the optimal potting effect in one operation without repeated sealing, and greatly improving the efficiency of single-station operation.

Currently, the intelligent dispensing and potting equipment is in the final commissioning stage. Upon completion, it will realize an all-process assembly line upgrade, which can seamlessly connect the customers' front-end component assembly stations and the back-end drying, aging and packaging processes, creating a fully unmanned dispensing and potting production line from component loading to finished product packaging. With no manual intervention throughout the process, it not only completely solves the quality pain points of manual potting, realizes precise and controllable adhesive volume and standardized and unified product quality, but also greatly reduces production labor costs, improves the automation level and production efficiency of the entire production line, and helps electronic component manufacturers achieve large-scale and intelligent production upgrading.

This customized intelligent dispensing and potting solution for small and micro electronic components directly addresses the core industry pain points of trace dispensing and potting. It achieves multiple breakthroughs in precise volume control, stable quality and unmanned operation through technological innovation, providing an efficient and reliable automated solution for the production and manufacturing of sensors, relays, vehicle electronic accessories and other categories. It is the preferred equipment for electronic component enterprises to improve quality and efficiency and move towards intelligent manufacturing!